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AN APPROACH FOR EVALUATING EPOXY ADHESIVES FOR USE IN HYBRID MICROELECTRONIC ASSEMBLY.PLANTING PY.1975; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1975; VOL. 11; NO 4; PP. 305-311; BIBL. 5 REF.Article

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